SAL Silicon Austria Labs GmbH

SAL brings the latest R&D knowledge of micro- and nanosensorics into industrial products and processes. We provide our partners with access to unique know-how as well as high-tech infrastructure. Our holistic R&D approach - from wafer level to intelligent systems - enables innovations for all kinds of industries.

Silicon Austria Labs GmbH (SAL) was founded in December 2018 as a new flagship of applied research in Austria. SAL stands for highest competence in all fields of the growth market Electronic-Based-Systems, from the single components and their interaction in the finished product to the embedding of various micro- and nanoelectronic components and the corresponding software. In July 2019, the former CTR AG (Carinthian Tech Research AG) became part of SAL, adding approximately 70 employees and the associated R&D infrastructure to the existing competence.

SAL is an internationally recognized and ISO 9001:2008 certified R&D institution, with extensive experience (more than 20 years) in conducting and managing R&D projects, both on the national (COMET Competence Centers for Excellent Technologies Programme, etc.) and the international (FP7, ENIAC) level. This research team has achieved several internationally acclaimed innovations and an extensive network of academic (Fraunhofer IPMS, EPFL, IMTEK, TU Wien, Johannes Kepler University Linz, etc.) and industrial partners (Infineon, AVL, Airbus, EPCOS, Philips etc.).

SAL Silicon Austria Labs GmbH

SAL GmbH Villach
Europastraße 12
9524 Villach


SAL will lead the WP4 and will contribute its expertise in the field of Heterogeneous Integration Technologies and Multiphysics simulation of GaN packages.

The expertise of the Area Heterogeneous Integration Technologies (HIT) is in the simulation, assembly and packaging of electronic devices. Multi-physics FEM simulations are carried out to study and optimise package designs leading to the approach of functional packaging and co-design, where chip and package are considered as inherently one system. The HIT department expands and fosters packaging processes for die and wire bonding. Ink-jet and 3D printing processes are studied for packaging tasks and sensor package prototypes. Special device characterisation methods are available in house (e.g. shear testing, Raman stress/strain characterisation).

Key Contribution

Multi-physics FEM Simulations (WP4)

In comparison to standard electronics packaging, GaN based power packages have to deal with further requirements like much higher voltages and currents or in case of RF very high frequency. Another challenge to tackle is the dissipation of heat leading to an increased reliability in field operation. To thoroughly address these technological issues, stress/strain and thermomechanical simulations are carried out, to study and optimise package designs for silicon based power electronic solutions.

Heterogeneous Integration Methods (WP4)

Within this task, SAL will apply integration methods that lead to the approach of co-design, where chip and package are considered as inherently one system. In particular, SAL will address one of the overall project goals, the significant increase of the power density in power electronic devices.

Interconnect, Dispensation and Printing Technologies (WP4)

SAL will investigate appropriate methods for die and wire bonding, Ink-jet and 3D printing processes to elaborate new approaches that are suitable for working in challenging environments under given specifications for power applications.