CTR Carinthian Tech Research AG
CTR brings the latest R&D knowledge of micro- and nanosensorics into industrial products and processes. We provide our partners with access to unique know-how as well as high-tech infrastructure. Our holistic R&D approach - from wafer level to intelligent systems - enables innovations for all kinds of industries.
CTR Carinthian Tech Research AG is one of Austria’s established non university research centres, with R&D foci on Advanced Sensor Systems and Smart System Integration. Founded in 1997 and located in Villach, CTR is an internationally recognized, ISO 9001:2008 certified R&D institution with a permanent staff of currently ~ 60 researchers.
With extensive experience in conducting and managing R&D projects, both on the national (COMET Competence Centres for Excellent Technologies Programme, etc.) and the international (FP7, ENIAC) level, CTR has achieved a number of internationally acclaimed innovations and an extensive network of academic (Fraunhofer IPMS, EPFL, IMTEK, TU Wien, Johannes Kepler University Linz, etc.) and industrial partners (Infineon, AVL, Airbus, EPCOS, Philips etc.)
CTR Carinthian Tech Research AG
CTR will lead the WP4 and will contribute its expertise in the field of Heterogeneous Integration Technologies and Multiphysics simulation of GaN packages.
The expertise of the Area Heterogeneous Integration Technologies (HIT) is in the simulation, assembly and packaging of electronic devices. Multi-physics FEM simulations are carried out to study and optimise package designs leading to the approach of functional packaging and co-design, where chip and package are considered as inherently one system. The HIT department expands and fosters packaging processes for die and wire bonding. Ink-jet and 3D printing processes are studied for packaging tasks and sensor package prototypes. Special device characterisation methods are available in house (e.g. shear testing, Raman stress/strain characterisation).
Multi-physics FEM Simulations (WP4)
In comparison to standard electronics packaging, GaN based power packages have to deal with further requirements like much higher voltages and currents or in case of RF very high frequency. Another challenge to tackle is the dissipation of heat leading to an increased reliability in field operation. To thoroughly address these technological issues, stress/strain and thermomechanical simulations are carried out, to study and optimise package designs for silicon based power electronic solutions.
Heterogeneous Integration Methods (WP4)
Within this task, CTR will apply integration methods that lead to the approach of co-design, where chip and package are considered as inherently one system. In particular, CTR will address one of the overall project goals, the significant increase of the power density in power electronic devices.
Interconnect, Dispensation and Printing Technologies (WP4)
CTR will investigate appropriate methods for die and wire bonding, Ink-jet and 3D printing processes to elaborate new approaches that are suitable for working in challenging environments under given specifications for power applications.