Technische Universität Chemnitz

Situated in the center of the Chemnitz “Wissenschaftsregion” (“science region”), TU Chemnitz is home to more than 11,400 students from 91 countries as well as of approximately 2,300 employees in science, engineering and management. Within the core competencies “Materials and Smart Systems”, “Resource-efficient Production and Lightweight Structures” and “Humans and Technology”, solutions for the challenges of tomorrow are developed.

Established in 1836 as Royal Mercantile College, TU Chemnitz soon developed into an academic institution renowned for its strong contributions to mechanical and electrical engineering. In 1986, it became Technical University. Today, it has over 11,000 students at the following eight faculties: Natural Sciences, Mathematics, Mechanical Engineering, Electrical Engineering and Information Technology, Computer Science, Economics and Business Administration, Humanities and Behavior, Social Sciences. The group of Prof. Rzepka at TU Chemnitz belongs to the Center for Microtechnologies (ZfM) within the faculty Engineering and Information Technology.

The group focuses on research and development in the field of thermo-mechanical reliability of electronics components and smart systems with partners in Germany, Europe and worldwide. It has over 25 years of experience in evaluating and optimizing of micro and power electronic components, packages, and systems regarding quality assurance, reliability, functionality and durability by combining advanced multi-field FEM simulation with latest experimental test methods.

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Technische Universität Chemnitz
Straße der Nationen 62
09111 Chemnitz


TU Chemnitz is leading and participating in task 5.4.2. 'Failure modes and mechanisms of packaged / assembled devices'. Main focus is set on the development of new reliability tests strategies for GaN packaged devices as well as on lifetime modeling based on physical failure analysis, modeling and simulation.

Key Contribution

The research group of Prof Rzepka will contribute active and passive thermal cycle reliability tests of GaN power devices and packages to WP5. The work aims at: i) expanding and massively improving the current lifetime models for power devices so that they are capable of covering GaN devices as well, ii) assessing the reliability of the new package(material)s under thermal cycles from RT and below to maximum temperatures beyond 250°C (i.e., up to 450°C).